Last edited by Shaktikinos
Tuesday, July 21, 2020 | History

5 edition of Mechanics of Solder Alloy Interconnects (Electrical Engineering) found in the catalog.

Mechanics of Solder Alloy Interconnects (Electrical Engineering)

by Darrel R. Frear

  • 195 Want to read
  • 15 Currently reading

Published by Springer .
Written in


The Physical Object
Number of Pages418
ID Numbers
Open LibraryOL7527499M
ISBN 100442015054
ISBN 109780442015053

  A variety of lead-free solder alloys were studied for use as flip-chip interconnects including SnAg, SnCu, SnAgCu, and eutectic SnPb as a baseline. The reaction behavior and reliability of these solders were determined in a flip-chip configuration using a variety of under-bump metallurgies (TiW/Cu, electrolytic nickel, and Cited by:   This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration.

Looking for books by John H. Lau? See all books authored by John H. Lau, including Ball Grid Array Technology, and Solder Joint Reliability: Theory and applications, and more on Mechanics of Solder Alloy Interconnects (Electrical Engineering) John H. Lau $ Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine. An analytical model is developed and implemented to analyze the deformation of solder columns in column-grid-array(CGA) assemblies. Each solder column is modeled as a prismatic beam of circular cross section subjected to end shearing deflections caused by thermal mismatch between the module and the circuit by: 4.

  Lead-Free Solder Interconnect Reliability. Lead-Free Solder Interconnect Reliability. Dongkai ShangguanASM International PublicationApproximately pagesScheduled to publish Summer/Fall available at: Keywords: Solder, Product reliability, Books This book provides the most uptodate knowledge and data available on the reliability of lead-free solder interconnects. 1. Introduction. Eutectic and near eutectic Pb/Sn solder alloys are the most commonly used interconnect materials in microelectronic packaging. In the microelectronics industry it is widely accepted that reliability of a package is assessed by the integrity of solder joints in by:


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Mechanics of Solder Alloy Interconnects (Electrical Engineering) by Darrel R. Frear Download PDF EPUB FB2

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a "stand-alone" resource for a particular aspect of materials and modeling issues.

With this gained understanding, the reader in search of a solution to Cited by: About this book The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues.

Springer Science & Business Media, - Computers - pages 1 Review The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability 1/5(1). The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment.

Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues.3/5(1). Mechanics of Solder Alloy Interconnects (Electrical Engineering) by Frear, Darrel R.

and a great selection of related books, art and collectibles available now at - Mechanics of Solder Alloy Interconnects Electrical Engineering by Frear, Darrel R ; Burchett, Steven N ; Morgan, Harold S ; Lau, John H - AbeBooks.

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Mechanics of Solder Alloy Interconnects (Electrical Engineering) Pdf. E-Book Review and Description: The Mechanics of Solder Alloy Interconnects is a useful resource for use in creating a solder joint reliability evaluation.

Every chapter is written for use as a stand-alone useful resource for a specific facet of supplies and modeling points.

This book has been developed as a resource to be used in developing a solder joint reliability assessment.

Topics include: the mechanics of solder alloy interconnect; microstructural influences on the mechanical properties of solder; interfaces and intermetallics; constitutivemodels; prediction of solder joint geometry; life prediction and accelerated testing.

inbunden,Engelska, ISBN The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone. SOLDER IS A FUSIBLE METAL ALLOY with a melting point (or range) of 90 to °C ( to °F), used in a process called soldering, years ago, mentions (in Chapter XLVIII of Book XXXIV) that the solder connections of the pipes of the Roman aqueducts were made with a mixture called tertiarium, an alloy of two parts lead and one part.

The Mechanics of Solder Alloy Interconnects by John H. Lau, Steven N. Burchett, Darrel Frear and Harold S. Morgan (, Hardcover) Be the first to write a review About this product.

Description: The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues.

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a "stand-alone" resource for a particular aspect of materials and modeling issues.3/5(1).

Comments "Prediction of Solder Joint Geometry", in Mechanics of Solder Alloy D.R. Frear, S. Burchett, H. Morgan, and J. Lau. New York: Van Cited by: Find many great new & used options and get the best deals for The Mechanics of Solder Alloy Interconnects by John H. Lau, Steven N. Burchett, at the best online prices at eBay.

Free shipping for many products!Seller Rating: % positive. Discusses economic, design, material, quality, and reliability issues of flip chip technologies, and details aspects of classical solder-bumped flip chip interconnect technologies; the next generations of flip chip technologies; and known-good-die testing for multiple module applications.

Annotation c. by Book News, Inc., Portland, Or. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research­ ers using the book are encouraged to formulate programs that will establish scien­ tific correlations between manufacturing process controls and product : Springer US.

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues.

With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and. The finite element procedure presented above is used for dynamic analysis of a Pb40/Sn60 solder joint in a surface mount technology microelectronics package, which is made up of a leadless ceramic chip carrier (LCCC) soldered to a printed wiring board (PWB), see Fig.

al properties of the solder are given in Table LCCC and the PWB are modeled Cited by: The correlation between interfacial reactions and mechanical strengths of Sn(Cu)/Ni(P) solder bumps has been studied.

Upon solid-state aging, a diffusion-controlled process was observed for the interfacial Ni-Sn compound formation of the Sn/Ni(P) reaction couple and the activation energy is calculated to be 42 KJ/mol.

For the SnCu/Ni(P), in the initial aging, a needle. IBM researchers invented together with colleagues from Intrinsiq Materials, SINTEF and the Technical University of Chemnitz a process where solder is replaced with copper to create All-Copper Interconnects. The physical limitation of the high melting temperature of copper (°C) was overcome.

A thermodynamic framework for damage mechanics is proposed. The damage evolution function uses entropy as a damage metric. A damage-coupled viscoplastic model with kinematic and isotropic hardening is implemented in a commercial finite element code to simulate the thermo-mechanical behavior of eutectic solder interconnectsin micro electronics Cited by: Sn-Pb eutectic solder alloy is extensively used in microelectronics packaging interconnects.

Due to the high homologous temperature, eutectic Sn-Pb solder exhibits creep-fatigue interaction and significant time- temperature- stress- and rate-dependent material by: